Development

Development

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From Concept to Scalable Production

Global Engineering Expertise

  • Industrial
  • Automotive
  • Medical
  • Telecom
  • IoT
  • Rail
  • Security

Design for Excellence

Design principles such as DFM (Design for Manufacturing), DFC (Design for Cost), and full lifecycle design are applied from the earliest development stages to enhance product quality and competitiveness.

Internal capabilities

Our internal laboratory capabilities include

  • 3D microscope
  • 2D X-ray inspection & X-ray CT  
  • Ionic contamination testing (resistivity solvent extraction)  
  • Staining tests  
  • Solderability testing  
  • Pull & shear testing  
  • Strain measurement 
  • OGP measurement 
  • Technical cleanliness measurement 

External capabilities

External laboratory capabilities include:

  • BGA endoscope  
  • C-SAM  
  • Curve tracer  
  • Decapsulation  
  • Ion chromatography contamination testing  
  • ROHS compliance testing  
  • Wetting balance solderability testing  
  • SEM / EDS  
  • FTIR analysis  
  • Thermal analysis (DSC, TGA, TMA, etc.)  
  • Cross sectioning 

Customized Test Development

A key differentiator of Aurightec is our on‑site capability to design and develop customized test solutions according to customer needs—a service that many companies rely on external providers for.

Our development capabilities include product and test system design, prototyping, new product introduction, and verification. We design and implement customer‑specific test concepts, including:

  • Functional and in‑circuit test solutions
  • End‑of‑line (EOL) test systems
  • Automated and semi‑automated test setups
  • Test fixtures, adapters, and test software

These solutions are developed in parallel with the product design to ensure early testability, higher fault coverage, faster ramp‑up, and stable serial production. Dedicated laboratory equipment and experienced test engineers support validation across prototype, NPI, and mass production phases.

Where required, we also cooperate with certified third‑party laboratories for EMC, RF, safety, CE, and other regulatory approvals.

Software, Simulation, Failure Analysis

Software development is supported from low‑level firmware and communication interfaces to advanced control, imaging, and automation solutions. Mechanical and electronic design can be combined with simulation and analysis to ensure reliable performance under real operating conditions.

Our specialists maintain a comprehensive failure analysis knowledge base and have extensive experience with typical electronic failures, including:

  • Solder joint cracks
  • Corrosion and electrochemical migration
  • ESD / EOS damage
  • MLCC cracks
  • Black pad
  • Tin whiskers
  • CAF
  • Popcorn effect
  • Other reliability‑related failure mechanisms

This expertise allows us to identify root causes quickly and implement robust design and test improvements.